High‑density SN/CS connectors, optical backplane, fiber arrays, AOC, DAC, OSFP, 1.6T modules and ultra‑high‑density panels for next‑gen data centers
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Optical Backplane Connectors
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Ultra‑High‑Density Interconnect
Next‑Gen Switching & Server Interconnect
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IISS Integrated Interconnect Systems is a global leader in high‑density optical and server interconnect solutions. We design and manufacture SN/CS connectors, optical backplane connectors, fiber arrays, AOC, DAC, OSFP modules, 1.6T optics, and ultra‑high‑density panels for data centers, AI clusters, and next‑gen switching networks.
With over 12 years of innovation, our products enable seamless migration to 400G/800G and beyond. We combine precision engineering, rigorous testing, and deep application knowledge to deliver interconnect solutions that drive performance and scalability.
We engineer reliable, high‑performance interconnect solutions that power the next generation of data centers and AI infrastructures
Our SN/CS connectors and fiber arrays pack more channels per unit area, maximizing port density and reducing footprint.
Tailored fiber counts, lengths, connector types, and breakout styles to match your exact network topology and server interconnect needs.
Products meet or exceed industry standards (TIA/EIA, IEEE, GR‑326) with modern aesthetics and clear labeling.
Our proprietary ferrule polishing process ensures ultra‑low insertion loss and high return loss for optical backplane and array applications.
We use top‑grade zirconia ferrules, low‑smoke zero‑halogen jackets, and high‑performance copper alloys for DAC cables.
Our engineering team is available around the clock to assist with deployment, troubleshooting, and custom design.
We offer full OEM/ODM services to help you differentiate your network infrastructure
Brand your own SN/CS connectors, fiber arrays, AOC, DAC, OSFP modules, and panels with your logo, packaging, and color schemes. We handle production, testing, and quality assurance.
Co‑develop new products from concept to production. Our R&D team can design custom backplane connectors, fiber arrays, or high‑speed cable assemblies tailored to your switch architecture.
Trusted by hyperscalers, telecom operators, and system integrators worldwide
IISS INTERCONNECT delivered our 1.6T OSFP modules and AOC cables ahead of schedule. The SN connectors performed flawlessly in our AI cluster, with zero link errors during burn‑in.
Network Architect, CloudScale Data
We switched to IISS's optical backplane connectors and fiber arrays for our next‑gen switch design. The density and signal integrity are outstanding, and the pricing is very competitive.
VP Engineering, FiberCore Networks
The custom DAC cables and ultra‑high‑density panels from IISS INTERCONNECT saved us 40% of rack space. Their support team guided us through the entire design process – highly recommended.
CTO, EdgeConnect Solutions
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