The basic structure of optical module package is Transmitting Optical Sub-Assembly (TOSA) and driving circuit, Receiving Optical Sub-Assembly (ROSA) and receiving circuit. The invention relates to the technical field of optical packaging, and particularly discloses a CPO optical module packaging structure and a wafer level packaging method thereof, wherein the CPO optical module packaging structure comprises the following components: providing an electric chip. The difference between hermetic and non-hermetic packaging of optical modules mainly lies in the packaging method applied in optical chip packaging—specifically, whether the light-emitting semiconductor chips and optical detectors are installed in a sealed cavity. Hermetic Packaging Hermetic. Selection 1: Packaging method and process: Hermetic packaging (TO-CAN, BOX, butterfly), non-hermetic packaging (COB, COC, etc. ) Selection 2: Optical chip types: VCSEL, DFB, EML, narrow linewidth tunable. Each option is directly related to certain performance requirements of the product and is. An optical module housing is the protective outer shell that encloses the internal components of an optical transceiver module. These modules are essential for converting electrical signals into light signals and vice versa, forming the backbone of fiber optic communication systems in data centers. PHIX is a one-stop-shop for the manufacturing of modules powered by photonic integrated circuits (PICs), from design to volume production. This document describes the core design guidelines for PICs that will enable PHIX to package your PIC into a high performance and cost-effective module that is.