Key Takeaway: Silicon photonics and co-packaged optics are the technologies enabling AI data center fabrics to scale to 800G/1. 6T per link while cutting power consumption by up to 70% — and network engineers who understand the optical layer will design better fabrics and troubleshoot. The next key development is 800G, and the industry is already gearing up to deploy this next generation of client optics in hyperscale data centers. Developments in three distinct areas are needed for 800G deployment: optical modules and direct attach copper (DAC) cables, switch ASICs, and 800GE. STMicroelectronics just entered high-volume production of its PIC100 silicon photonics platform — the manufacturing technology behind the 800G and 1. 6T modules edge closer to reality. Experimental & simulation analysis show 800G-LR4 is technically feasible in LAN-WDM (e.
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